Methods for creating an electronic skin with integrated temperature sensors based on highly expandable polyimide substrate have been developed. Stresses and strains due to electronic skin expansion are minimized through unique designs developed using finite element analysis. Through the use of a uniquely patterned polyimide substrate an expansion ratio of 1,000% is achieved and the electrical resistance of wire components is maintained from pre-expansion to full expansion. Platinum resistance temperature detectors and electrodes are integrated directly in the polyimide-based electronic skin through a non-standard micro fabrication process. Real-time distributed temperature measurement has been achieved through this highly expandable electronic skin.1
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