Understanding the impact response of lead-free solder at high strain rates
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Wenbin Tang | Xu Long | X. Long | Wenbin Tang | Chang Chao | Chao Chang | Shaobin Wang | Junmeng Xu | Shaobin Wang | Junmeng Xu
[1] Johan Liu,et al. Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation , 2018, International Journal of Applied Mechanics.
[2] Yi-Shao Lai,et al. High-G drop impact response and failure analysis of a chip packaged printed circuit board , 2007 .
[3] Leon M. Keer,et al. Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation , 2018 .
[4] X. Shu,et al. Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation , 2014 .
[5] D. Fang,et al. Temperature Rise Associated with Adiabatic Shear Band: Causality Clarified. , 2019, Physical review letters.
[6] Willem D. van Driel,et al. Advances in the drop-impact reliability of solder joints for mobile applications , 2009, Microelectron. Reliab..
[7] X. Long,et al. Constitutive behaviour and life evaluation of solder joint under the multi-field loadings , 2018, AIP Advances.
[8] X. Long,et al. Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder , 2018, Micromachines.
[9] Xu He,et al. Annealing effect to constitutive behavior of Sn–3.0Ag–0.5Cu solder , 2018, Journal of Materials Science: Materials in Electronics.
[10] L. Keer,et al. Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments , 2017 .
[11] Z. Zhang,et al. Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling , 2014, Journal of Electronic Materials.
[12] Suhana Mohd Said,et al. A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints , 2012 .
[13] Yi-Shao Lai,et al. Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling , 2008 .
[14] P. Perzyna,et al. The Physics and Mathematics of Adiabatic Shear Bands , 2002 .
[15] X. Long,et al. Cooling and Annealing Effect on Indentation Response of Lead-Free Solder , 2017 .
[16] Johan Liu,et al. Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles , 2019, Materials Science and Engineering: A.
[17] Mohd Faizul Mohd Sabri,et al. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products , 2012, Microelectron. Reliab..
[18] Xu Long,et al. An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates , 2017, Journal of Materials Science.
[19] Stephen M. Walley,et al. Mechanical properties of SnPb and lead-free solders at high rates of strain , 2005 .
[20] Xu Long,et al. Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging , 2019, Applied Sciences.
[21] H. Hao,et al. Compressive behaviour of tungsten fibre reinforced Zr-based metallic glass at different strain rates and temperatures , 2017 .