R. Jacob Baker, CMOS Circuit Design, Layout, and Simulation (second ed.), Wiley Interscience & IEEE Press (2005) ISBN 0-471-70055-X Hardcover, pp 1039, plus XXXIII

Semiconductor industry has achieved a phenomenal growth over the last three decades. This incredible growth has come from steady miniaturization of transistors and improvements in manufacturing processes. Semiconductor devices are the basic building blocks from which all types of useful electronic products are constructed-amplifiers, computers, high-frequency communications equipment, power supplies, control systems, medical equipment, consumer electronics, etc. CMOS integrated circuits (ICs) are the enabling technology for the modern information age. Because of their intrinsic features in low-power consumption, large noise margins, and easy of design, CMOS ICs have been widely used to develop microprocessor chips, digital signal processor chips, ASICs, ASIPs, System-on-a-Chip (SoC) designs, and Multiprocessor SoCs. The popular use of CMOS ICs continues to grow with the increasing demands for high-performance, improved functionality, low power, and low noise integrated electronic systems in the development of portable computers, portable phones, and different types of embedded systems. The field of CMOS ICs is very broad. It is conventionally divided into digital CMOS circuits and analog CMOS circuits. This book is focused on both CMOS ICs. The aim of this book is to present the readers the basic concepts of CMOS circuit design. IT covers the following four areas: physical IC design (chapters 1–7 and 10–15), analog IC design (chapters 8–9 and 20– 24), digital logic and memory circuits design (chapters 16–19), and advanced analog IC design (chapters 25– 29). A comprehensive Index is included in the end of this book. The details of each chapter are as follows: Chapter 1, Introduction to CMOS Design, pp. 1–30, briefly explains to a reader the basic principles of CMOS design process. In addition it discusses setting up the LASI layout software and introduces SPICE. Chapter 2, The Well, pp. 31–58, deals with the well as the first layer fabricated when making VLSI IC. Chapter 3, The Metal Layers, pp. 59–82, presents the fundamental concepts of the metal layers in CMOS IC used to connect circuit elements such as MOSFETs,