Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

[1]  R. Mahmudi,et al.  High-temperature shear strength of lead-free Sn–Sb–Ag/Al2O3 composite solder , 2011 .

[2]  C. J. Fang,et al.  Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish , 2011 .

[3]  Mohd Rafie Johan,et al.  Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing , 2011 .

[4]  Y. S. Kim,et al.  Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders , 2010 .

[5]  Qijie Zhai,et al.  Synthesis and DSC study on Sn3.5Ag alloy nanoparticles used for lower melting temperature solder , 2010 .

[6]  Jaewon Chang,et al.  Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C , 2010 .

[7]  Jong-Woong Kim,et al.  Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading , 2010 .

[8]  Y. C. Chan,et al.  Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads , 2009 .

[9]  Y. C. Chan,et al.  Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages , 2009, Microelectron. Reliab..

[10]  A. Fawzy,et al.  Effect of Ag addition on the creep characteristics of Sn–8.8 wt%Zn solder alloy , 2009 .

[11]  John Hald,et al.  Development of gold based solder candidates for flip chip assembly , 2009, Microelectron. Reliab..

[12]  Yi-Wun Wang,et al.  Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates , 2009, Microelectron. Reliab..

[13]  Xuefeng Zhang,et al.  Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints , 2009, Microelectron. Reliab..

[14]  J. Shen,et al.  Research advances in nano-composite solders , 2009, Microelectron. Reliab..

[15]  Yi-Shao Lai,et al.  Recent research advances in Pb-free solders , 2009, Microelectron. Reliab..

[16]  Namhyun Kang,et al.  Reaction properties and interfacial intermetallics for Sn−xAg−0.5Cu solders as a function of Ag content , 2008 .

[17]  R. Mahmudi,et al.  Impression creep of hypoeutectic Sn–Zn lead-free solder alloys , 2008 .

[18]  K. Suganuma,et al.  Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions , 2008 .

[19]  Hamideh Khanbareh,et al.  Effect of cooling rate on the room-temperature impression: creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders , 2008 .

[20]  V. Kripesh,et al.  Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy , 2008 .

[21]  Masahiro Inoue,et al.  Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy , 2008 .

[22]  Chien-Chung Jao,et al.  Phase equilibria of the Sn–Zn–Ag system and interfacial reactions in Sn–Zn/Ag couples , 2008 .

[23]  J. Wei,et al.  Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder , 2008 .

[24]  Seung-Boo Jung,et al.  Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging , 2007 .

[25]  Meng Zhang,et al.  On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material , 2007 .

[26]  Y. C. Chan,et al.  Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints , 2007 .

[27]  Han Gao,et al.  Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder , 2006 .

[28]  Sean Wu,et al.  Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn–9Zn eutectic alloy , 2006 .

[29]  Y. C. Chan,et al.  Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn-In-Ag-Cu solders with Ni-P under bump metallization , 2006 .

[30]  Li-Hui Chen,et al.  Resonant vibration behavior of Sn-Zn-Ag solder alloys , 2004 .

[31]  Gautam Ghosh,et al.  Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates , 2004 .

[32]  King-Ning Tu,et al.  Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test , 2004 .

[33]  Chang Yong Park,et al.  Effect of bismuth on the growth kinetics of intermetallic compounds in Sn-3.5Ag solder joints: A growth kinetic model , 2004 .

[34]  Won Kyoung Choi,et al.  Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders , 2003 .

[35]  T. S. Srivatsan,et al.  Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder , 2003 .

[36]  Kwang-Lung Lin,et al.  Wetting interaction between Sn-Zn-Ag solders and Cu , 2003 .

[37]  J. Duh,et al.  Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging , 2001 .

[38]  Fu Guo,et al.  Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles , 2001 .

[39]  Sung K. Kang.  Development of lead (Pb)-free interconnection materials for microelectronics , 1999 .

[40]  Kwang-Lung Lin,et al.  Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate , 1998 .

[41]  Sungho Jin,et al.  New, creep-resistant, low melting point solders with ultrafine oxide dispersions , 1998 .

[42]  Sungho Jin,et al.  New, lead-free solders , 1994 .

[43]  Zbigniew Moser,et al.  The Sn−Zn (Tin-Zinc) system , 1985 .

[44]  S. Xue,et al.  Development of Sn–Zn lead-free solders bearing alloying elements , 2010 .

[45]  Weiqun Peng,et al.  An investigation of Sn pest in pure Sn and Sn-based solders , 2009, Microelectron. Reliab..

[46]  Katsuaki Suganuma,et al.  Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems , 2006 .

[47]  William D. Callister,et al.  Materials Science and Engineering: An Introduction , 1985 .