모바일 폰용 마이크로스피커의 음향 및 전기 해석

In this paper, GUI program for microspeaker system simulation program was developed and verified through closed box, vent box and 6th order bandpass enclosure system. By using the pseudo loudspeaker model concept, TS parameters and rear volume of microspeaker were identified. Their suitabilities were proved by comparing test results with simulations of electrical impedance and sound pressure response curves for the three box types; closed box, vent box and 6th order bandpass box. Also, MSSP was found to be effective regardless of the microspeaker’s shape, either circular or rectangular shape. MSSP can be used for the microspeaker system simulation, and can give a general prediction of such as; sound pressure level curve, electrical impedance, diaphragm velocity and displacement curve according to multiple design parameters; diaphragm mass, compliance, force factor, front and rear volume, front and rear port"s diameter and length.