Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF

Flip chip packaging of ultra fine pitch integrated circuits (ICs) on organic substrates aggravates the stress-strain concerns, requiring a fundamentally different system approach to interconnections, underfill, interfaces, and the substrate. This work demonstrates a novel interconnection solution with excellent reliability for ultra-fine pitch (∼30µm) silicon (Si) on organic first level interconnections by using copper (Cu) pillar with nano-anisotropic conductive film (nano-ACF)/non conductive Film (NCF).

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