Reactive nanolayers for physiologically compatible microsystem packaging

[1]  Hongyu Yu,et al.  Localized Parylene-C bonding with reactive multilayer foils , 2009 .

[2]  X. Qiu.  Reactive Multilayer Foils , 2009 .

[3]  Hongyu Yu,et al.  Flexible Polymer Sensors for In Vivo Intravascular Shear Stress Analysis , 2008, Journal of Microelectromechanical Systems.

[4]  Xiaotun Qiu,et al.  Bonding silicon wafers with reactive multilayer foils , 2008 .

[5]  Y. Tai,et al.  Micromachined High-Aspect-Ratio Parylene Spring and Its Application to Low-Frequency Accelerometers , 2006, Journal of Microelectromechanical Systems.

[6]  R. Gutmann,et al.  Adhesive wafer bonding , 2006 .

[7]  K. Najafi,et al.  Characterization of low-temperature wafer bonding using thin-film parylene , 2005, Journal of Microelectromechanical Systems.

[8]  T. Velten,et al.  Packaging of bio-MEMS: strategies, technologies, and applications , 2005, IEEE Transactions on Advanced Packaging.

[9]  Omar M. Knio,et al.  Effects of physical properties of components on reactive nanolayer joining , 2005 .

[10]  F. Tay,et al.  Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser , 2005 .

[11]  M. Schmidt,et al.  Characterization of wafer-level thermocompression bonds , 2004, Journal of Microelectromechanical Systems.

[12]  Omar M. Knio,et al.  Investigating the effect of applied pressure on reactive multilayer foil joining , 2004 .

[13]  Omar M. Knio,et al.  Reactive nanostructured foil used as a heat source for joining titanium , 2004 .

[14]  T. P. Weihs,et al.  Room-temperature soldering with nanostructured foils , 2003 .

[15]  Timothy P. Weihs,et al.  Joining bulk metallic glass using reactive multilayer foils , 2003 .

[16]  M. Schmidt.  Wafer-to-wafer bonding for microstructure formation , 1998, Proc. IEEE.

[17]  Omar M. Knio,et al.  Joining of stainless-steel specimens with nanostructured Al/Ni foils , 2004 .