ESD protection design for high-speed I/O interface of stub series terminated logic (SSTL) in a 0.25-/spl mu/m salicided CMOS process

ESD protection design for high-speed I/O interface of stub series terminated logic (SSTL) is proposed. The SSTL I/O buffer with the proposed ESD protection design, which is designed to operate with a clock of 400 MHz, has been fabricated and verified in a 0.25-/spl mu/m salicided CMOS process. The human-body-model (HBM) and machine-model (MM) ESD levels of this SSTL I/O buffer can be greater than 8 kV and 750 V, respectively. Based on the excellent ESD performance, one set of area-efficient I/O cell library for SSTL in 1.8 V applications with this ESD protection design has been built up in a 0.25-/spl mu/m salicided CMOS process.

[1]  C. Duvvury,et al.  Dynamic gate coupling of NMOS for efficient output ESD protection , 1992, 30th Annual Proceedings Reliability Physics 1992.

[2]  Chung-Yu Wu,et al.  A gate-coupled PTLSCR/NTLSCR ESD protection circuit for deep-submicron low-voltage CMOS ICs , 1997 .

[3]  Ming-Dou Ker,et al.  Design on the low-leakage diode string for using in the power-rail ESD clamp circuits in a 0.35-/spl mu/m silicide CMOS process , 2000, IEEE Journal of Solid-State Circuits.

[4]  T. Polgreen,et al.  A low-voltage triggering SCR for on-chip ESD protection at output and input pads , 1990, IEEE Electron Device Letters.

[5]  Betty Prince Application specific DRAMs Today , 2003, Records of the 2003 International Workshop on Memory Technology, Design and Testing.