论文信息 - Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device - 字舞流文

Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device

D. Kwong | V. Sundaram | R. Tummala | C. Selvanayagam | Xiaowu Zhang | V. Kripesh | J. Lau | V. S. Rao | A. Kumar | N. Khan | R. Rajoo