Modelling of thermal vias in thin film multichip modules

A semi-analytical model is presented for evaluating the thermal resistance of via networks used in thin film multichip modules. Correlations between dimensionless groups were derived from numerical data. Therefore, the via network was divided in three basic elements. This allows one to reconstruct the network as a series and parallel connection. The results of this semi-analytical model are compared with those of an existing analytical model and a 3D finite element model. Good agreement between the three models was obtained. The heat conduction efficiency of a staggered thermal via network is defined and the influence of several parameters was investigated.<<ETX>>