Balanced SiGe PA Module for Multi-Band and Multi-Mode Cellular-Phone Applications

In this paper, the integration of a MM (GSM/EDGE/WCDMA) MB (850/900MHz, 1800/1900/2100MHz) 50 Omega-matched isolator-less flip-chip PAs, capable of envelope and power tracking operation, is discussed. The PAs are integrated in a 0.25 mum SiGe technology and are soldered on a 4-layer substrate. The system is hosted in a 6 x 8 mm2 plastic module.

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