Effects of photoresist polymer molecular weight on line-edge roughness and its metrology probed with Monte Carlo simulations

A fast 2D/3D resist dissolution algorithm based on the critical ionization model is used to quantify line-edge roughness and determine its relation to resist polymer molecular weight, the end-to-end distance and the radius of gyration, keeping acid effects off (i.e., minimal). The algorithm permits also simulations of line-edge roughness metrology by examining the effects of SEM measurement box length.

[1]  Hideo Namatsu,et al.  Generation mechanism of surface roughness in resists: free volume effect on surface roughness , 2002, SPIE Advanced Lithography.

[2]  Shiying Xiong,et al.  Gate line-edge roughness effects in 50-nm bulk MOSFET devices , 2002, SPIE Advanced Lithography.

[3]  Shinji Okazaki,et al.  Correlation of Nano Edge Roughness in Resist Patterns with Base Polymers , 1993 .

[4]  James W. Taylor,et al.  Factors contributing to sidewall roughness in a positive-tone, chemically amplified resist exposed by x-ray lithography , 1999 .

[5]  Lewis W. Flanagin,et al.  Advancements to the critical ionization dissolution model , 2002 .

[6]  Kenji Yamazaki,et al.  New development model: aggregate extraction development , 1998, Advanced Lithography.

[7]  Shigeru Moriya,et al.  Study of the acid-diffusion effect on line edge roughness using the edge roughness evaluation method , 2002 .

[8]  Bryan J. Rice,et al.  Effects of processing parameters on line-width roughness , 2003, SPIE Advanced Lithography.

[9]  Evangelos Gogolides,et al.  Monte Carlo simulation of gel formation and surface and line-edge roughness in negative tone chemically amplified resists , 2003 .

[10]  H. Namatsu,et al.  Line-Edge Roughness: Characterization and Material Origin , 2002, 2002 International Microprocesses and Nanotechnology Conference, 2002. Digest of Papers..

[11]  E. Gogolides,et al.  Surface and line-edge roughness in solution and plasma developed negative tone resists: Experiment and simulation , 2000 .

[12]  Yasuo Takahashi,et al.  Three-dimensional siloxane resist for the formation of nanopatterns with minimum linewidth fluctuations , 1998 .

[13]  Ioannis Raptis,et al.  Simulation of roughness in chemically amplified resists using percolation theory , 1999 .

[14]  Jonathan L. Cobb,et al.  Controlling line-edge rougness to within reasonable limits , 2003, SPIE Advanced Lithography.

[15]  Yoshio Kawai,et al.  Line-edge roughness characterized by polymer aggregates in photoresists , 1999, Advanced Lithography.

[16]  Angeliki Tserepi,et al.  Quantification of line-edge roughness of photoresists. I. A comparison between off-line and on-line analysis of top-down scanning electron microscopy images , 2003 .

[17]  Andrew G. Glen,et al.  APPL , 2001 .

[18]  Angeliki Tserepi,et al.  Roughness analysis of lithographically produced nanostructures: off-line measurement and scaling analysis , 2003 .

[19]  Kenji Yamazaki,et al.  Nanometer-scale linewidth fluctuations caused by polymer aggregates in resist films , 1997 .

[20]  Jangho Shin,et al.  Resist line edge roughness and aerial image contrast , 2001 .

[21]  P. A. Orphanos,et al.  Roughness study of a positive tone high performance SCALPEL resist , 2000 .

[22]  Modeling the impact of photoresist trim etch process on photoresist surface roughness , 2003 .

[23]  Kenji Kurihara,et al.  Resist Materials Providing Small Line-Edge Roughness , 1999 .

[24]  Franco Cerrina,et al.  Line edge roughness and photoresist percolation development model , 2003 .

[25]  Evangelos Gogolides,et al.  Simulation of surface and line-edge roughness formation in resists , 2001 .

[26]  Angeliki Tserepi,et al.  Quantification of line-edge roughness of photoresists. II. Scaling and fractal analysis and the best roughness descriptors , 2003 .

[27]  Franco Cerrina,et al.  Line edge roughness of sub-100 nm dense and isolated features: Experimental study , 2003 .

[28]  Pavlos C. Tsiartas,et al.  Electrostatic effects during dissolution of positive tone photoresists , 2002 .

[29]  Lewis W. Flanagin,et al.  Molecular model of phenolic polymer dissolution in photolithography , 1999 .

[30]  L. E. Ocola Soluble site density model for negative and positive chemically amplified resists , 2003 .

[31]  Shinji Okazaki,et al.  Nanometer-Scale Imaging Characteristics of Novolak Resin-Based Chemical Amplification Negative Resist Systems and Molecular-Weight Distribution Effects of the Resin Matrix , 1994 .