The Effects of Irradiation Temperature on the Proton Response of SiGe HBTs

We compare, for the first time, the effects of 63 MeV protons on 1st generation and 3rd generation SiGe HBTs irradiated at both liquid nitrogen temperature (77 K) and at room temperature (300 K). The 1st generation SiGe HBTs irradiated at 77 K show less degradation than when irradiated at 300 K. Conversely, the 3rd generation SiGe HBTs exhibits an opposite trend, and the devices irradiated at 77 K show enhanced degradation compared to those irradiated at 300 K. The emitter-base spacer regions for these two SiGe technologies are fundamentally different in construction, and apparently are responsible for the observed differences in temperature-dependent radiation response. At practical circuit biases, both SiGe technology generations show only minimal degradation for both at 77 K and 300 K exposure, to Mrad dose levels, and are thus potentially useful for electronics applications requiring simultaneous cryogenic temperature operation and significant total dose radiation exposure

[1]  Wei-Min Lance Kuo,et al.  Proton tolerance of fourth-generation 350 GHz UHV/CVD SiGe HBTs , 2004, IEEE Transactions on Nuclear Science.

[2]  R. Reed,et al.  An investigation of the origins of the variable proton tolerance in multiple SiGe HBT BiCMOS technology generations , 2002 .

[3]  B. Jagannathan,et al.  A 0.18 /spl mu/m BiCMOS technology featuring 120/100 GHz (f/sub T//f/sub max/) HBT and ASIC-compatible CMOS using copper interconnect , 2001, Proceedings of the 2001 BIPOLAR/BiCMOS Circuits and Technology Meeting (Cat. No.01CH37212).

[4]  S. Jeng,et al.  A SiGe HBT BiCMOS technology for mixed signal RF applications , 1997, Proceedings of the 1997 Bipolar/BiCMOS Circuits and Technology Meeting.

[5]  Fan Chen,et al.  Silicon-Germanium Heterojunction Bipolar Transistors , 2002 .

[6]  C.M. Castaneda Crocker Nuclear Laboratory (CNL) radiation effects measurement and test facility , 2001, 2001 IEEE Radiation Effects Data Workshop. NSREC 2001. Workshop Record. Held in conjunction with IEEE Nuclear and Space Radiation Effects Conference (Cat. No.01TH8588).

[7]  David L. Griscom,et al.  Formation of interface traps in MOSFETs during annealing following low temperature irradiation , 1988 .

[8]  R. Reed,et al.  Proton tolerance of third-generation, 0.12 /spl mu/m 185 GHz SiGe HBTs , 2003 .

[9]  D. Harame,et al.  SILICON:GERMANIUM HETEROJUNCTION BIPOLAR TRANSISTORS: FROM EXPERIMENT TO TECHNOLOGY , 1994 .

[10]  C. Grens,et al.  Assessing reliability issues in cryogenically-operated SiGe HBTs , 2005, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..

[11]  Ronald D. Schrimpf,et al.  The effects of ionizing radiation on commercial power MOSFETs operated at cryogenic temperatures , 1994 .

[12]  Proton Tolerance of a Third-Generation , 0 . 12 μ m 185 GHz SiGe HBT Technology , 2003 .

[13]  D. Griscom,et al.  Formation of interface traps in metal‐oxide‐semiconductor devices during isochronal annealing after irradiation at 78 K , 1991 .

[14]  F. Guarin,et al.  A comparison of gamma and proton radiation effects in 200 GHz SiGe HBTs , 2005, IEEE Transactions on Nuclear Science.

[15]  John D. Cressler,et al.  On the Potential of SiGe HBTs for Extreme Environment Electronics , 2005, Proceedings of the IEEE.

[16]  S. Jeng,et al.  Self-aligned SiGe NPN transistors with 285 GHz f/sub MAX/ and 207 GHz f/sub T/ in a manufacturable technology , 2002, IEEE Electron Device Letters.

[17]  Alvin J. Joseph,et al.  The impact of gamma irradiation on SiGe HBTs operating at cryogenic temperatures , 2003 .