System-in-Package (SiP)

System-in-package (SiP) technology has been used extensively on consumer products such as smartwatches, smartphones, tablets, notebooks, TWS (true wireless stereo), etc. The key assembly processes of SiP technology are basically SMT (surface mount technology) and flip chip technology, which will be presented and discussed in this chapter. The difference between the SoC (system-on-chip) and SiP, the intention and actual applications of SiP, and some examples in using SiP technology to manufacture consumer products will be briefly mentioned first.

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