Making method of printed circuit board

The present invention relates to a method of manufacturing a printed circuit board. The present invention is relatively provided on the inside and the first circuit pattern 12 is formed in the first insulating layer 10, the first on to cover the first circuit pattern 12 first insulating layer 10 on both sides of the surface 'and laminating a turn, the metal layer (22, second insulating layer 20 and metal layer 22' on the surface) and the second insulating layer 20 selectively to the first circuit pattern 12 by removing the and selectively exposed to form a blind hole (25) presented by the metal layer (22 ') surface of the plating mask (40) installed in the blind hole 25 of the first circuit pattern to ensure that only the plating is carried out inside of a for 12 and the metal layer (22 ') to a step of electrically forming a connecting protrusion (50) for connection to the metal layer 22' is selectively removed by claim comprising two circuits to form a pattern (22) It is configured to. In the present invention, it may be decreasing the space configuration is occupied for a circuit electrically connected to the pattern in the different layers and at the same time forming a finer circuit pattern miniaturize the printed circuit board, while using the particular material and the existing equipment circuit pattern can be finely formed to be relatively low, resulting in the manufacturing cost of the printed circuit board, using a plating connection between a circuit pattern layer, so better the quality of the printed circuit board. A printed circuit board, an interlayer connection plating