Effects of tip clearance and fin density on the performance of heat sinks for VLSI packages
暂无分享,去创建一个
[1] Thomas F. Irvine,et al. Fully Developed Pressure Drop in Triangular Shaped Ducts , 1961 .
[2] J. P. Hartnett,et al. A Comparison of Predicted and Measured Friction Factors for Turbulent Flow Through Rectangular Ducts , 1962 .
[3] L. Mahalingam,et al. Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic Circuits , 1983 .
[4] Ephraim M Sparrow,et al. Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment , 1982 .
[5] E. Sparrow,et al. Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components , 1983 .
[6] Ephraim M Sparrow,et al. Effect of tip-to-shroud clearance on turbulent heat transfer from a shrouded, longitudinal fin array , 1986 .
[7] Ephraim M Sparrow,et al. Forced Convection Heat Transfer from a Shrouded Fin Array with and without Tip Clearance , 1978 .
[8] Ephraim M Sparrow,et al. Numerical and experimental study of turbulent heat transfer and fluid flow in longitudinal fin arrays , 1986 .
[9] R. Pease,et al. High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.
[10] R. L. Mahajan,et al. Convective Heat Transfer From Longitudinal Fin Arrays in the Entry Region of Turbulent Flow , 1989 .