Impact of Interface Charges on the Transient Characteristics of 4H-SiC DMOSFETs

In this paper, we study the transient characteristics of 4H-SiC DMOSFETs with different interface charges to improve the turn-on rising time. A physics-based two-dimensional mixed device and circuit simulator was used to understand the relationship between the switching characteristics and the physical device structures. As the SiO2/SiC interface charge increases, the current density is reduced and the switching time is increased, which is due primarily to the lowered channel mobility. The result of the switching performance is shown as a function of the gate-to-source capacitance and the channel resistance. The results show that the switching performance of the 4H-SiC DMOSFET is sensitive to the channel resistance that is affected by the interface charge variations, which suggests that it is essential to reduce the interface charge densities in order to improve the switching speed in 4H-SiC DMOSFETs.

[1]  J.A. Cooper,et al.  A 1-kV 4H-SiC Power DMOSFET Optimized for Low on-Resistance , 2007, IEEE Transactions on Electron Devices.

[2]  W. Marsden I and J , 2012 .

[3]  Xueqing Li,et al.  Demonstration of the first SiC power integrated circuit , 2008 .

[4]  Andrew G. Glen,et al.  APPL , 2001 .

[5]  Abdelmalik Taleb-Ahmed,et al.  Medical Image Compression Using Quincunx Wavelets and SPIHT Coding , 2012 .

[6]  Akira Toriumi,et al.  Inverter performance of 0.10 /spl mu/m CMOS operating at room temperature , 1994 .

[7]  Eisuke Tokumitsu,et al.  High channel mobility 4H-SiC metal-oxide-semiconductor field-effect transistor with low temperature metal-organic chemical-vapor deposition grown Al2O3 gate insulator , 2008 .

[8]  N. Rimmer,et al.  Investigation of the 4H–SiC surface , 2008 .

[9]  Juhoon Back,et al.  Power Regulation of Variable Speed Wind Turbines using Pitch Control based on Disturbance Observer , 2012 .

[10]  A. Agarwal,et al.  10 A, 2.4 kV Power DiMOSFETs in 4H-SiC , 2002, IEEE Electron Device Letters.

[11]  L. Eastman,et al.  A new 4H-SiC normally off lateral channel vertical JFET with extremely low power losses: source inserted double-gate structure with a supplementary highly doped region , 2005, IEEE Transactions on Electron Devices.

[12]  Chafic Salame,et al.  Temperature dependence of a silicon power device switching parameters , 2006 .

[13]  J. Cooper,et al.  Optimization of on-State and Switching Performances for 15–20-kV 4H-SiC IGBTs , 2008, IEEE Transactions on Electron Devices.

[14]  K. Matocha Challenges in SiC power MOSFET design , 2008 .

[15]  J. Cooper,et al.  A self-aligned process for high-voltage, short-channel vertical DMOSFETs in 4H-SiC , 2004, IEEE Transactions on Electron Devices.