Residual stresses and cracking in brittle solids bonded with a thin ductile layer

Abstract Residual stresses that exist between two brittle materials bonded by a thin ductile layer are calculated. In particular, the stresses at and near the interface are examined as well as the plastic zone profile. The stress intensity factors associated with interface cracks are then computed and used to address problems of cracking and bond strength. The analysis reveals the relative influence of thermal expansion mismatch, yield strength, bond thickness and interface fracture resistance.