Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
暂无分享,去创建一个
Rudolf Schlangen | S. Li | K. Yu | Frank Altmann | Ted Lundquist | C. Schmidt | Hervé Deslandes | A. Andreasyan | F. Altmann | H. Deslandes | T. Lundquist | K. Yu | R. Schlangen | Christian Schmidt | A. Andreasyan | S. Li
[1] Rudolf Schlangen,et al. Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography , 2010, 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
[2] Thomas W. Lee,et al. Microelectronic failure analysis : desk reference , 1993 .
[3] Frank Altmann,et al. Lock-in-Thermography for 3- dimensional localization of electrical defects inside complex packaged devices , 2008 .
[4] Philippe Perdu,et al. Dynamic laser stimulation techniques for advanced failure analysis and design debug applications , 2007, Microelectron. Reliab..