论文信息 - Electroless plating alloy thin-film embedded resistor materials

Electroless plating alloy thin-film embedded resistor materials

Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films' sheet resistance, corrosion resistance and hardness increase with the increase of P content.

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