Investigation of atomic diffusion behavior of Mo/Au interface
暂无分享,去创建一个
H. Fan | Kang L. Wang | Wenbo Hu | Shengli Wu | Hongxing Wang | H. Bai
[1] Kang L. Wang,et al. Room temperature bonding of Si and Si wafers by using Mo/Au nano-adhesion layers , 2019, Microelectronic Engineering.
[2] Y. Kurashima,et al. Surface activated bonding of Ti/Au and Ti/Pt/Au films after vacuum annealing for MEMS packaging , 2018, Microelectronic Engineering.
[3] Y. Kurashima,et al. Room-temperature bonding of single-crystal diamond and Si using Au/Au atomic diffusion bonding in atmospheric air , 2018, Microelectronic Engineering.
[4] M. Uomoto,et al. Atomic Diffusion Bonding for Optical Devices with High Optical Density , 2018, ECS Transactions.
[5] Y. Kurashima,et al. Room-temperature Au–Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns , 2018 .
[6] E. Higurashi,et al. Surface activated bonding of Au/Ta layers after degas annealing for MEMS packaging , 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
[7] H. Mohseni,et al. InGaAs/InP quantum well infrared photodetector integrated on Si substrate by Mo/Au metal-assisted wafer bonding , 2018 .
[8] M. SamsonovVladimir,et al. Solid-state wetting at the nanoscale: molecular dynamics and surface diffusion approach , 2017 .
[9] J. F. Wu,et al. Atomic Diffusion Behavior in W/Cu Diffusion Bonding Process , 2015 .
[10] Andreas Meyer,et al. The measurement of self-diffusion coefficients in liquid metals with quasielastic neutron scattering , 2015 .
[11] Z. Jiao,et al. Joint properties between carbon nanotube and gold at different energy levels from molecular dynamics , 2013 .
[12] N. Luo,et al. Atomic diffusion behavior in Cu-Al explosive welding process , 2013 .
[13] L. Schultz,et al. Quantitative measurement of the surface self-diffusion on Au nanoparticles by aberration-corrected transmission electron microscopy. , 2012, Nano letters.
[14] T. Suga,et al. Low-Temperature Bonding of GaN on Si Using a Nonalloyed Metal Ohmic Contact Layer for GaN-Based Heterogeneous Devices , 2012, IEEE Journal of Quantum Electronics.
[15] M. Uomoto,et al. Atomic diffusion bonding of wafers with thin nanocrystalline metal films , 2010 .
[16] Shan Chen,et al. Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al , 2007 .
[17] P. Hui,et al. Molecular dynamics simulation of the diffusion bonding and tensile behavior of a Cu-Al interface , 2007 .
[18] A. Soh,et al. Molecular Dynamics Modeling of Diffusion Bonding , 2005 .
[19] James B. Adams,et al. Self-diffusion and impurity diffusion of fcc metals using the five-frequency model and the Embedded Atom Method , 1989 .