Experimental investigation of wire electrical discharge machining of gallium-doped germanium

Abstract This paper investigates the electrical discharge machining of gallium-doped p-type germanium with a relaxation type pulse generator. A series of experiments were performed to establish the slicing rate for different types and sizes of electrode wires. The cut samples were analyzed using a 3D optical profiler and a scanning electron microscope (SEM) for surface roughness and subsurface damage. The samples were etched and analyzed for any contamination using an X-ray energy dispersive spectrometer (EDS). This paper also investigates the use of small wire diameters (50–200 μm) to enhance slicing rate and surface characteristics. The maximum discharge energy at which germanium can be machined without any subsurface damage was determined using the experiments. The phenomenon of increase in slicing rate with decrease in wire diameter is explained using the concept of discharge energy density ( E d ).

[1]  Y. F. Luo,et al.  Investigation of silicon wafering by wire EDM , 1992 .

[2]  K. Malloy,et al.  The Mechanical Properties of Semiconductors , 1992 .

[3]  Yunn-Shiuan Liao,et al.  Study of electrical discharge machining technology for slicing silicon ingots , 2003 .

[4]  Masanori Kunieda,et al.  Advancing EDM through fundamental insight into the process , 2005 .

[5]  Dominiek Reynaerts,et al.  Machining of three-dimensional microstructures in silicon by electro-discharge machining , 1998 .

[6]  Dominiek Reynaerts,et al.  Experimental study of micro-EDM machining performances on silicon wafer , 2000 .

[7]  S. Ghandhi,et al.  Chemical Etching of Germanium , 1988 .

[8]  B. Schumacher After 60 years of EDM the discharge process remains still disputed , 2004 .

[9]  W. Arnold,et al.  An innovative method for preparing semiconductor charges used in crystal growth and shear cell diffusion experiments , 1997 .

[10]  Masanori Kunieda,et al.  Improvement of EDM efficiency of silicon single crystal through ohmic contact , 2000 .

[11]  P. T. Eubank,et al.  Wire vibration, bowing, and breakage in wire electrical discharge machining , 2001 .

[12]  D. Aiken,et al.  The development of >28% efficient triple-junction space solar cells at Emcore Photovoltaics , 2003, 3rd World Conference onPhotovoltaic Energy Conversion, 2003. Proceedings of.

[13]  S. Sze Semiconductor Devices: Physics and Technology , 1985 .

[14]  Paul Horowitz,et al.  The Art of Electronics , 1980 .

[15]  Kazuo Yamazaki,et al.  High efficiency fine boring of monocrystalline silicon ingot by electrical discharge machining , 1999 .