A novel stack package solution of AC-DC chip for high-power density adapters

With the increase of output power and temperature, traditional package technology for AC-DC chips, such as dual inline-pin (DIP) package, can no longer be used in high-power density adapters due to the poor heat dissipation characteristic. In order to solve the problem, a novel package solution for AC-DC chips applied in high output power situations is introduced in this paper. The AC-DC chip is TO-220-5L packaged in which the control IC is stacked on the power MOSFET. The thermal simulations of both the original DIP package and the improved stack TO-220-5L package are presented as a comparison. The junction temperatures of devices in the proposed TO-220-5L package turn out to be much lower than that in DIP package. A steady state thermal test is also made on an adapter with 36W output power to verify the practicability of the novel stack packaged AC-DC chip. As a result, a steady temperature of 94.8°C implies that the improved package solution can solve the over-heat issue and work as normal in such high-power density adapters.