Research on Crucial Manufacturing Process of Rigid-Flex PCB
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The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Board (PCB) is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process, is discussed in detail. Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches to 89.4%.
[1] W. Schillhammer. Advances In Flex/rigid Flex Circuit Prototyping Technology , 1994, Proceedings of NORTHCON '94.