Analysis of a Vertical Interconnection Access by Using Longitudinal Wave Concept Iteratve Process (LWCIP)

A new formulation of the Wave Concept Iterative Process (WCIP) method is presented in this work. This approach uses an analysis with the longitudinal components instead of the transverse components. This approach includes decomposing the transverse TM modes into two longitudinal terms: the TM and TEM modes. This approach is applied to model a Vertical Interconnect Access VIA hole. The current density behavior is studied in the two cases with and without VIA hole. Also this method is used to study a SIW slot antenna. Compared to those obtained by available published data, our results show that the proposed method gives convincing results.

[1]  S. Schelkunoff.  Generalized telegraphist's equations for waveguides , 1952 .

[2]  Ali Gharsallah,et al.  Global modelling of microwave active circuits by an efficient iterative procedure , 2001 .

[3]  Vincent Fusco,et al.  Low Insertion Loss Substrate Integrated Waveguide Quasi–Elliptic Filters for V- Band Wireless Personal Area Network Applications , 2011 .

[4]  L. Perregrini,et al.  Dispersion characteristics of substrate integrated rectangular waveguide , 2002, IEEE Microwave and Wireless Components Letters.

[5]  Wei Hong,et al.  Investigations on the propagation characteristics of the substrate integrated waveguide based on the method of lines , 2005 .

[6]  Ke Wu,et al.  Accurate modeling, wave mechanisms, and design considerations of a substrate integrated waveguide , 2006, IEEE Transactions on Microwave Theory and Techniques.

[7]  Ali Gharsallah,et al.  Global modeling of a periodic coplanar waveguide structure for filter applications using an efficient iterative procedure , 2004 .

[8]  H. Baudrand,et al.  Various Aspects of Coupled-Mode Theory for Anisotropic Partially - Filled Waveguides. Application to a Semi-Conductor Loaded Wave-Guide with Perpendicular Induction , 1977, 1977 7th European Microwave Conference.

[9]  Wei Hong,et al.  37–38 GHz substrate integrated filtenna for wireless communication application , 2012 .

[10]  Yogeshwar Kosta,et al.  Design and performance analysis of metallic posts coupled SIW‐based multiband bandpass and bandstop filter , 2015 .

[11]  Christian Schuster,et al.  Physics-Based Via and Waveguide Models for Efficient SIW Simulations in Multilayer Substrates , 2015, IEEE Transactions on Microwave Theory and Techniques.

[12]  L. Perregrini,et al.  Low-Cost and High-Q Millimeter-Wave Resonator Using Substrate Integrated Waveguide Technique , 2002, 2002 32nd European Microwave Conference.

[13]  Ali Gharsallah,et al.  Design and modeling of RF MEMS switch by reducing the number of interfaces , 2007 .

[14]  Jun Fan,et al.  Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz , 2009, IEEE Transactions on Microwave Theory and Techniques.

[15]  Yong Zhang,et al.  A High-Q Microwave MEMS Resonator , 2007, ArXiv.

[16]  Tomas Mikulasek,et al.  SIW slot antennas utilized for 60‐GHz channel characterization , 2015 .

[17]  Ke Wu,et al.  Single-substrate integration technique of planar circuits and waveguide filters , 2003 .

[19]  Ke Wu,et al.  Design Consideration and Performance Analysis of Substrate Integrated Waveguide Components , 2002, 2002 32nd European Microwave Conference.