Feasibility Study of Unconventional Cooling of Electronic Components by Vibrating Plates at Close Proximity

ABSTRACT In this study, an unconventional approach to electronic cooling is described, and its feasibility is investigated. This approach makes use of the transverse oscillations of a short plate placed in close proximity to the electronic component to provide for focused and localized cooling. This method can be applied for intermediate cooling rates, above those of natural convection, in order to extend the no-fan regime. To estimate the cooling potential, a numerical simulation of the temperature field in a channel formed by an oscillating surface and a fixed constant heat flux surface is performed. The results show that transverse oscillations have the potential for significant cooling enhancement compared to pure natural convection. The cooling effect is found to increase with the oscillation amplitude and channel length to mean width ratio and, to a lesser extent, with the oscillation frequency.

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