A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
暂无分享,去创建一个
[1] J. Hutchinson,et al. Plastic flow localization due to non-uniform void distribution , 1984 .
[2] N. Fleck,et al. Analysis of Crack Closure Under Plane Strain Conditions , 1988 .
[3] Huajian Gao,et al. Numerical simulation of crack growth in an isotropic solid with randomized internal cohesive bonds , 1998 .
[4] A. Gurson. Plastic flow and fracture behavior of ductile materials incorporating void nucleation, growth and interaction , 1988 .
[5] N. Dowling. Crack Growth During Low-Cycle Fatigue of Smooth Axial Specimens , 1977 .
[6] James Lankford,et al. THE GROWTH OF SMALL FATIGUE CRACKS IN 7075–T6 ALUMINUM , 1982 .
[7] Ilya B. Mirman. Effects of Peeling Stresses in Bimaterial Assembly , 1991 .
[8] Hiroshi Tada,et al. The stress analysis of cracks handbook , 2000 .
[9] O. Richmond,et al. The evolution of damage and fracture in iron compacts with various initial porosities , 1988 .
[10] Z. Suo,et al. A model of evolving damage bands in materials , 1997 .
[11] R. Ritchie,et al. Propagation of short fatigue cracks , 1984 .
[12] S. Suresh. Fatigue of materials , 1991 .
[13] Huajian Gao,et al. Crack nucleation and growth as strain localization in a virtual-bond continuum , 1998 .
[14] THE BEHAVIOUR OF SHORT CRACKS , 1982 .
[15] S. Pearson. Initiation of fatigue cracks in commercial aluminium alloys and the subsequent propagation of very short cracks , 1975 .
[16] Yonggang Huang,et al. Thermal Stresses in Layered Electronic Assemblies , 1997 .