Hybrid Filter Design for 5G using IPD and Acoustic Technologies
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Chengjie Zuo | Chenggong He | Wei Cheng | Zheng Wang | Cheng-ji Zuo | Z. Wang | Chenggong He | Wei-Kang Cheng
[1] R. Weigel,et al. Design and performance of UHF band inductors, capacitors and resonators using LTCC technology for mobile communication systems , 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192).
[2] Osamu Ikata,et al. A design of antenna duplexer using ladder type SAW filters , 1998, 1998 IEEE Ultrasonics Symposium. Proceedings (Cat. No. 98CH36102).
[3] M. Esashi,et al. ScAlN Lamb wave resonator in GHz range released by XeF2 etching , 2013, 2013 IEEE International Ultrasonics Symposium (IUS).
[4] A. Pisano,et al. Piezoelectric Aluminum Nitride Vibrating Contour-Mode MEMS Resonators , 2006, Journal of Microelectromechanical Systems.
[5] K. Hashimoto,et al. Suboptimization of Electrode-Withdrawal Weighted SAW Filters , 1979, IEEE Transactions on Sonics and Ultrasonics.
[6] C. Cassella,et al. Active and Inactive Frames Improve Figure of Merit of Two Dimensional Mode Resonators , 2018, IUS.
[7] M. Kadota,et al. High-Frequency Lamb Wave Device Composed of LiNbO3 Thin Film , 2008, 2008 IEEE Ultrasonics Symposium.
[8] Masahiro Hiramoto,et al. Investigations on design technologies for SAW quadplexer with narrow duplex gap , 2016, 2016 IEEE MTT-S International Microwave Symposium (IMS).
[9] M. Solal,et al. Spurious Free SAW Resonators on Layered Substrate with Ultra-High Q, High Coupling and Small TCF , 2018, 2018 IEEE International Ultrasonics Symposium (IUS).
[10] M. Megahed,et al. Comparison and analysis of integrated passive device technologies for wireless radio frequency module , 2008, 2008 58th Electronic Components and Technology Conference.
[11] D. Petit,et al. Integration of cellular front end modules on advanced high resistivity SOI RF CMOS technology , 2011, 2011 IEEE Topical Conference on Power Amplifiers for Wireless and Radio Applications.
[12] K. Suzuki,et al. Single crystal FBAR with LiNbO3 and LiTaO3 piezoelectric substance layers , 2007, 2007 IEEE/MTT-S International Microwave Symposium.
[13] Geoff L. Brennecka,et al. Enhanced piezoelectric response of AlN via CrN alloying. , 2017, 1708.00490.
[14] M. Rinaldi,et al. A 2.8 GHz combined mode of vibration aluminum nitride MEMS resonator with high figure of merit exceeding 45 , 2013, 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC).
[15] Robert Weigel,et al. A Hybrid Acoustic-Wave Resonator and Lumped-Element Ladder Filter , 2018, 2018 IEEE International Ultrasonics Symposium (IUS).
[16] T. Nakao,et al. Incredible high performance SAW resonator on novel multi-layerd substrate , 2016, 2016 IEEE International Ultrasonics Symposium (IUS).
[17] Gianluca Piazza,et al. High electromechanical coupling MEMS resonators at 530 MHz using ion sliced X-cut LiNbO3 thin film , 2012, 2012 IEEE/MTT-S International Microwave Symposium Digest.
[18] E. Yoon,et al. CMOS-compatible surface-micromachined suspended-spiral inductors for multi-GHz silicon RF ICs , 2002 .
[19] Y. Gu,et al. Spurious Mode Free 3.5GHz AlN Plate Mode Resonator with High FoM , 2018, 2018 IEEE International Ultrasonics Symposium (IUS).
[20] R. Ruby,et al. Micromachined thin film bulk acoustic resonators , 1994, Proceedings of IEEE 48th Annual Symposium on Frequency Control.
[21] R. Aigner,et al. Advancement of MEMS into RF-filter applications , 2002, Digest. International Electron Devices Meeting,.
[22] Xiaoyu Mi,et al. Integrated Passives for High-Frequency Applications , 2010 .
[23] R. Meyer,et al. Si IC-compatible inductors and LC passive filters , 1990 .
[24] J. D. Larson,et al. Modified Butterworth-Van Dyke circuit for FBAR resonators and automated measurement system , 2000, 2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121).
[25] Tokihiro Nishihara,et al. Highly piezoelectric co-doped AlN thin films for bulk acoustic wave resonators , 2013, 2013 IEEE International Ultrasonics Symposium (IUS).
[26] J. Burghartz,et al. Integrated multilayer RF passives in silicon technology , 1998, 1998 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (Cat. No.98EX271).
[27] J. Hartung,et al. Integrated passive components in MCM-Si technology and their applications in RF-systems , 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
[28] Kai Liu,et al. Full-Circuit Design Optimization of a RF Silicon Integrated Passive Device , 2006, 2006 IEEE Electrical Performane of Electronic Packaging.
[29] Takashi Ogami,et al. 4.5 GHz Lamb wave device composed of LiNbO3 thin film , 2009, 2009 IEEE MTT-S International Microwave Symposium Digest.
[30] R. Naylor,et al. The preparation and application of tantalum thin film passive components , 1967 .
[31] Jonghae Kim,et al. Cross-sectional dilation mode resonator with very high electromechanical coupling up to 10% using AlN , 2012, 2012 IEEE International Frequency Control Symposium Proceedings.
[32] Anming Gao,et al. 5 Ghz lithium niobate MEMS resonators with high FoM of 153 , 2017, 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS).
[33] Kai Liu,et al. Small Form-Factor Integrated Passive Devices for SiP Applications , 2007, 2007 IEEE/MTT-S International Microwave Symposium.
[34] D. C. Webb,et al. Surface acoustic wave devices for communications , 1975 .
[35] Nobuaki Kawahara,et al. Enhancement of Piezoelectric Response in Scandium Aluminum Nitride Alloy Thin Films Prepared by Dual Reactive Cosputtering , 2009, Advanced materials.
[36] A. Teshigahara,et al. Giant shear mode electromechanical coupling coefficient k15 in c-axis tilted ScAlN films , 2010, 2010 IEEE International Ultrasonics Symposium.
[37] Jongsik Lim,et al. Compact Size and Wideband Triplexer Using SAW Resonators and LC Components , 2018, 2018 IEEE/MTT-S International Microwave Symposium - IMS.
[38] G. Piazza,et al. AlN Two-Dimensional-Mode Resonators for Ultra-High Frequency Applications , 2015, IEEE Electron Device Letters.
[39] Gianluca Piazza,et al. Investigation of 20% scandium-doped aluminum nitride films for MEMS laterally vibrating resonators , 2017, 2017 IEEE International Ultrasonics Symposium (IUS).