Scaling considerations and dielectric breakdown improvement of a corrugated capacitor cell for a future dRAM

Further scaling of a corrugated capacitor cell (CCC) consisting of a moat capacitor is discussed in terms of cell configuration and device parameters. From the results of experimental analyses and device simulation, key parameters of cell scaling are suggested. In addition to the cell scalability, some improvements in dielectric breakdown of the capacitor insulator are described. This insulator integrity is a key issue for the reliability of dRAM's having a CCC.

[1]  D.L. Crook,et al.  Techniques of evaluating long term oxide reliability at wafer level , 1978, 1978 International Electron Devices Meeting.

[2]  T. P. Lee,et al.  Depletion layer capacitance of cyclindrical and spherical p-n junctions , 1967 .

[3]  Mitsumasa Koyanagi,et al.  Intermediate Oxide Formation in Double‐Polysilicon Gate MOS Structure , 1980 .

[4]  A.F. Tasch,et al.  The Hi-C RAM cell concept , 1977, IEEE Transactions on Electron Devices.

[5]  R. B. Marcus,et al.  The Oxidation of Shaped Silicon Surfaces , 1982 .

[6]  T. Kure,et al.  A corrugated capacitor cell (CCC) for megabit dynamic MOS memories , 1983, IEEE Electron Device Letters.

[7]  S. Ogura,et al.  Design and characteristics of the lightly doped drain-source (LDD) insulated gate field-effect transistor , 1980 .

[8]  S. Asai,et al.  A numerical model of avalanche breakdown in MOSFET's , 1978, IEEE Transactions on Electron Devices.

[9]  Hideo Sunami,et al.  Characteristics of a Buried-Channel, Graded Drain with Punch-Through Stopper (BGP) MOS Device , 1981, 1981 Symposium on VLSI Technology. Digest of Technical Papers.

[10]  S. Asai,et al.  Submicrometer MOSFET structure for minimizing hot-carrier generation , 1982, IEEE Transactions on Electron Devices.

[11]  W. M. Regitz,et al.  A three transistor-cell, 1024-bit, 500 NS MOS RAM , 1970 .

[12]  H. Sunami,et al.  A corrugated capacitor cell (CCC) , 1984, IEEE Transactions on Electron Devices.

[13]  V.L. Rideout,et al.  One-device cells for dynamic random-access memories: A tutorial , 1979, IEEE Transactions on Electron Devices.

[14]  B. S. Kiyoo Itoh,et al.  High-density one-device dynamic MOS memory cells , 1983 .

[15]  W.G. Oldham Isolation technology for scaled MOS VLSI , 1982, 1982 International Electron Devices Meeting.

[16]  P.E. Cottrell,et al.  Hot-electron emission in N-channel IGFET's , 1979, IEEE Transactions on Electron Devices.

[17]  K. Itoh,et al.  High Density Memory Cell Structure , 1981, 1981 Symposium on VLSI Technology. Digest of Technical Papers.

[18]  K. Itoh,et al.  An experimental 1Mb DRAM with on-chip voltage limiter , 1984, 1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.

[19]  James D. Meindl,et al.  Thermal Oxidation of Heavily Phosphorus‐Doped Silicon , 1978 .

[20]  T. May,et al.  Alpha-particle-induced soft errors in dynamic memories , 1979, IEEE Transactions on Electron Devices.

[21]  H. Sunami,et al.  Two-dimensional numerical model of memory devices with a corrugated capacitor cell structure , 1985, IEEE Transactions on Electron Devices.

[22]  Shojiro Asai,et al.  Submicrometer MOSFET structure for minimizing hot-carrier generation , 1982 .

[23]  S. Nakajima,et al.  A submicron CMOS megabit level dynamic RAM technology using doped face trench capacitor cell , 1983, 1983 International Electron Devices Meeting.

[24]  Hideo Sunami Thermal Oxidation of Phosphorus‐Doped Polycrystalline Silicon in Wet Oxygen , 1978 .

[25]  Hsiao-Liang Chen,et al.  A Limitation of Channel Length in Dynamic Memories , 1980, IEEE Journal of Solid-State Circuits.