Wafer-Level Vacuum-Encapsulated Lamé Mode Resonator With f-Q Product of $2.23 \times 10^{13}$ Hz

We present a wafer-level vacuum-encapsulated silicon resonator fabricated in MEMS Integrated Design for Inertial Sensors, a commercial pure-play MEMS process, recently introduced by Teledyne DALSA Semiconductor Inc. Our prototype Lamé mode encapsulated in an ultra-clean 10-mtorr vacuum cavity, achieved a quality factor of 3.24 million at a resonance frequency of 6.89 MHz, resulting in the highest recorded f-Q product of 2.23 × 1013 Hz for wafer-level vacuum-encapsulated silicon resonators fabricated in a commercial MEMS process.

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