Self-alignment in the stacking of microchips with mist-induced water droplets

This paper reports a novel and versatile water droplet self-alignment technique where the water is delivered in mist form onto the assembly site. The droplet forming process has been carefully investigated using machine vision, where each individual droplet on the microchip surface can be identified and the volume per surface area can be calibrated at a specific time. The result reveals that the volume of water droplets on the assembly surface grows linearly as a function of time. Self-alignment based on the mist-induced droplets has been studied, where a robotic microgripper is used to deliver the microchips on the assembly site. The paper also investigates the maximum tolerance of the initial placement error in stacking SU-8 chips 200 × 200 × 70 µm in size, and the possibility of stacking two SU-8 chips of different dimensions using the proposed self-alignment technique. Moreover, self-alignment of chips on hydrophilic/hydrophobic patterns covered by mist-induced water droplets has been studied. The experimental results indicate that this novel self-alignment technique is very promising. Furthermore, a statistical model has been used to validate the experimental results.

[1]  H. Yeh,et al.  Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates , 1994, IEEE Photonics Technology Letters.

[2]  Kenneth Y. Goldberg,et al.  Parallel microassembly with electrostatic force fields , 1998, Proceedings. 1998 IEEE International Conference on Robotics and Automation (Cat. No.98CH36146).

[3]  R. Howe,et al.  Microstructure to substrate self-assembly using capillary forces , 2001 .

[4]  G. Whitesides,et al.  Self-Assembly at All Scales , 2002, Science.

[5]  Clifton G. Fonstad Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique , 2002 .

[6]  Y. Hanein,et al.  Controlled Multi-Batch Self-Assembly of Micro Devices , 2002 .

[7]  Quan Zhou,et al.  Development of a flexible force-controlled piezo-bimorph microgripping system , 2003 .

[8]  Heikki N. Koivo,et al.  Droplet based self-assembly of SU-8 microparts , 2003 .

[9]  Jiandong Fang,et al.  Controlled multibatch self-assembly of microdevices , 2003 .

[10]  Yutaka Ohno,et al.  Direct integration of GaAs HEMTs on AlN ceramic substrates using fluidic self-assembly , 2005 .

[11]  Babak A. Parviz,et al.  Self-assembled single-crystal silicon circuits on plastic , 2006, Proceedings of the National Academy of Sciences.

[12]  Jiandong Fang,et al.  Wafer-level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes) , 2006 .

[13]  Karl F. Böhringer,et al.  Parallel micro component-to-substrate assembly with controlled poses and high surface coverage , 2006 .

[14]  V. Kripesh,et al.  Self-Assembly of Components using Shape-matching , 2007, 2007 9th Electronics Packaging Technology Conference.

[15]  Quan Zhou,et al.  Strategies in Automatic Microhandling , 2007, 2007 International Conference on Mechatronics and Automation.

[16]  D. Gracias,et al.  Surface tension-driven self-folding polyhedra. , 2007, Langmuir : the ACS journal of surfaces and colloids.

[17]  K.F. Bohringer,et al.  A fully dry self-assembly process with proper in-plane orientation , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.

[18]  Quan Zhou,et al.  Experimental study on droplet based hybrid microhandling using high speed camera , 2008, 2008 IEEE/RSJ International Conference on Intelligent Robots and Systems.

[19]  Quan Zhou,et al.  Hybrid microhandling: a unified view of robotic handling and self-assembly , 2008 .

[20]  D. Gracias,et al.  Self-assembly of orthogonal three-axis sensors , 2008 .

[21]  Quan Zhou,et al.  Environmental effects on droplet self-alignment assisted hybrid microassembly , 2009, 2009 IEEE International Symposium on Assembly and Manufacturing.

[22]  Quan Zhou,et al.  Three dimensional hybrid microassembly combining robotic microhandling and self-assembly , 2009, 2009 IEEE International Conference on Robotics and Automation.

[23]  Quan Zhou,et al.  Hybrid Microassembly Combining Robotics and Water Droplet Self-Alignment , 2010, IEEE Transactions on Robotics.

[24]  Heiko O. Jacobs,et al.  Self-assembly of microscopic chiplets at a liquid–liquid–solid interface forming a flexible segmented monocrystalline solar cell , 2010, Proceedings of the National Academy of Sciences.