论文信息 - Development of novel fabrication techniques for a silicon micro-vertex detector unit using the Flip-Chip bonding method - 字舞流文

Development of novel fabrication techniques for a silicon micro-vertex detector unit using the Flip-Chip bonding method

D. Tatsumi | C. Fukunaga | T. Kawasaki | S. Okuno | H. Ozaki | J. Haba | T. Tsuboyama | Y. Nagashima | T. Matsuda | Y. Higashi | K. Adachi | T. Matsushita | M. Kamiya | M. Mandai | S. Koike | K. Miyano | S. Avrillon | Y. Saitoh | J. Yamanaka | H. Ikeda | O. Koseki | Y. Fujita | S. Mori | K. Yusa | H. Hanai | H. Miyata | S. Miyahara | H. Takeuchi | Tomoyuki Yoshino | H. Kanazawa | M. Ikeda | M. Tanaka