3D Integration of MEMS and IC: Design, Technology and Simulations

A 3D integrated silicon stack consisting of two MEMS devices and two IC devices is presented. The MEMS devices are a pressure sensor and a bulk acoustic resonator (BAR). The stack was constructed for a tire pressure monitoring system (TPMS) which was one out of three demonstrators for an EU funded project called e-CUBES. Thermal simulations were performed to check the level of thermo-mechanical stresses induced on the pressure sensor membrane during extreme environmental conditions. Additional simulations were made to calculate the exact temperature on the BAR device during operation as this was important for the operational frequency. This paper presents and discusses the technology choices made for the stacking of the pressure sensor and the BAR. Results are given from simulations, initial short-loop experiments and for the final stacking.

[1]  Keith A. Jenkins,et al.  Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection , 2005, IBM J. Res. Dev..

[2]  M. Flatscher,et al.  Design issues of BAW employment in 3D integrated sensor nodes , 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.

[3]  Nicolas Lietaer.  MEMS Sensor/IC Integration for Miniaturized TPMS (e-CUBES) , 2008 .

[4]  Roland Martin,et al.  Design aspects of 3D integration of MEMS-based systems , 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.

[5]  R. Gaddi,et al.  RF–MEMS wafer-level packaging using through-wafer interconnect , 2008 .

[6]  Paul Enquist.  High Density Direct Bond Interconnect (DBI) Technology for Three Dimensional Integrated Circuit Applications , 2006 .

[7]  Markus Dielacher,et al.  Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES) , 2009 .

[8]  Fan Ji,et al.  Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging , 2008 .

[9]  Preben Storås,et al.  Development of cost-effective high-density through-wafer interconnects for 3D microsystems , 2006 .

[10]  Peter Ramm,et al.  3D stacked MEMS and ICs in a miniaturized sensor node , 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.

[11]  Josef Prainsack,et al.  3D MEMS and IC Integration , 2008 .

[12]  Preben Storås,et al.  Technologies enabling 3D stacking of MEMS , 2010 .

[13]  Andreas Ostmann,et al.  3D System Integration Technologies , 2003 .

[14]  Daniel F. Baldwin,et al.  High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging , 2003 .

[15]  T. Kenny,et al.  Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates , 2002 .