Dielectric reliability of 70nm pitch air-gap interconnect structures
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G. Beyer | H. Bender | F. Sebaai | K. Kellens | H. Struyf | A. Moussa | M. Pantouvaki | B. Vereecke | J. Versluijs | D. Goossens | E. V. Besien | R. Caluwaerts | K. Marrant