3D MEMS Simulation Modeling Using Modified Nodal Analysis

The modeling, simulation, and experimental verification of several MEMS devices are presented. Simulated results include 3D mode analysis, residual stress effects, thermal expansion, nonlinear deflections, time-varying electrostatic forces, process sensitivities, induced currents, and the transient performance in accelerated reference frames. To simulate the performance of these MEMS devices a modified nodal analysis approach is used to formulate a system of ODEs that is solved by static, steady state, and transient solvers. Index Terms SUGAR, modified nodal analysis, static, steady state, transient, accelerating frames, sensitivity.

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