论文信息 - Analysing current density in the solder joints of chip-size Surface Mounted resistors

Analysing current density in the solder joints of chip-size Surface Mounted resistors

The paper discusses a numerical modelling research, where different sized Surface Mounted Device (SMD) chip-size resistors and their solder joints are analysed from the aspect of current density. The solder joint structure and the connecting traces to the Printed Circuit Board (PCB) solder pads define the route of the current in the structure, where corners may form areas with higher current density, increasing the possibility of electromigration. In our research, we used 0201, 0402 and 0603 jumper resistors for the highest applicable current load. The paper presents the process of 3D modelling, where the shape of the solder joint is calculated with Surface Evolver. The current routes and the possible regions with high current stresses are calculated with Finite Element Method (FEM). The results highlight the critical configuration of solder joint shape, connecting trace direction and current load on the given components.

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