论文信息 - Copper metallization influence on power MOS reliability

Copper metallization influence on power MOS reliability

Abstract This work presents the influence of copper when it is introduced in very small quantities into the metallization. The techniques implemented for the characterization are those commonly available in the industry: the characterization method, which will be presented, can be used to highlight problems of copper diffusion on finished devices.

Eric Moreau | Jean-Michel Reynes | Adeline Feybesse | Ivana Deram

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