A computational modelling framework to predict macroscopic phenomena in solder joint formation

Abstract A computational model of solder joint formation and the subsequent cooling behaviour is described. Given the rapid changes in the technology of printed circuit boards, there is a requirement for comprehensive models of solder joint formation which permit detailed analysis of design and optimization options. Solder joint formation is complex, involving a range of interacting phenomena. This paper describes a model implementation (as part of a more comprehensive framework) to describe the shape formation (conditioned by surface tension), heat transfer, phase change and the development of elastoviscoplastic stress. The computational modelling framework is based upon mixed finite element and finite volume procedures, and has unstructured meshes enabling arbitrarily complex geometries to be analysed. Initial results for both through-hole and surface-mount geometries are presented.

[1]  Esteban P. Busso,et al.  A forward gradient time integration procedure for an internal variable constitutive model of Sn–Pb solder , 1994 .

[2]  Nicholas J. Nigro,et al.  Finite Element Method for Predicting Equilibrium Shapes of Solder Joints , 1993 .

[3]  Chris Bailey,et al.  Multiphysics modelling of the metals casting process , 1996, Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences.

[4]  L. Racz,et al.  Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits. , 1993 .

[5]  Chris Bailey,et al.  A finite volume procedure to solve elastic solid mechanics problems in three dimensions on an unstructured mesh , 1995 .

[6]  Gareth A. Taylor A vertex based discretisation scheme applied to material non-linearity within a multi-physics finite volume framework , 1996 .

[7]  Julian Szekely,et al.  A General Statement of the Problem and Description of a Proposed Method of Calculation for Some Meniscus Problems in Materials Processing , 1993 .

[8]  V. Voller,et al.  ERAL SOURCE-BASED METHOD FOR SOLIDIFICATION PHASE CHANGE , 1991 .

[9]  Gareth A. Taylor,et al.  Solution of the elastic/visco-plastic constitutive equations: A finite volume approach , 1995 .

[10]  F. M. Hosking,et al.  The Mechanics of Solder Alloy Wetting and Spreading , 1993 .

[11]  D. R. Frear,et al.  Solder mechanics : a state of the art assessment , 1991 .

[12]  C. Handwerker,et al.  Dynamic Aspects of Wetting Balance Tests , 1996 .

[13]  Peter M.-Y. Chow Control volume unstructured mesh procedure for convection-diffusion solidification processes , 1993 .

[14]  Miguel Cervera,et al.  A finite volume format for structural mechanics , 1994 .

[15]  M. Cross,et al.  An enthalpy control‐volume—unstructured‐mesh (cv—um) algorithm for solidification by conduction only , 1992 .

[16]  Nicholas J. Nigro,et al.  Solder Joint Formation in Surface Mount Technology—Part I: Analysis , 1990 .

[17]  Nick Croft PHYSICA - A software environment for the modelling of multi-physics phenomena , 1996 .