Implications of radiation-induced dopant deactivation for npn bipolar junction transistors

Metal-oxide-silicon capacitors fabricated in a bipolar process were examined for densities of oxide trapped charge, interface traps and deactivated substrate acceptors following high-dose-rate irradiation at 100/spl deg/C. Acceptor neutralization near the Si surface occurs most efficiently for small irradiation biases in depletion. The bias dependence is consistent with compensation and passivation mechanisms involving the drift of H/sup +/ ions in the oxide and Si layers and the availability of holes in the Si depletion region. The capacitor data were used to simulate the impact of acceptor neutralization on the current gain of an irradiated npn bipolar transistor. Neutralized accepters near the base surface enhance current gain degradation associated with radiation-induced oxide trapped charge and interface traps by increasing base recombination. The additional recombination results from the convergence of carrier concentrations in the base and increased sensitivity of the base to oxide trapped charge. The enhanced gain degradation is moderated by increased electron injection from the emitter. These results suggest that acceptor neutralization may complicate hardness assurance test methods for linear circuits, which are based on elevated temperature irradiations.

[1]  Effects of oxide charge and surface recombination velocity on the excess base current of BJTs , 1993, 1993 Proceedings of IEEE Bipolar/BiCMOS Circuits and Technology Meeting.

[2]  J. P. David,et al.  An attempt to define conservative conditions for total dose evaluation of bipolar ICs , 1997 .

[3]  H. E. Boesch,et al.  Interface state generation associated with hole transport in metal‐oxide‐semiconductor structures , 1986 .

[4]  J. L. Titus,et al.  Enhanced low dose rate sensitivity (ELDRS) in a voltage comparator which only utilizes complementary vertical NPN and PNP transistors , 1999 .

[5]  E. W. Enlow,et al.  Response of advanced bipolar processes to ionizing radiation , 1991 .

[6]  Patrick M. Lenahan,et al.  Hole traps and trivalent silicon centers in metal/oxide/silicon devices , 1984 .

[7]  Leite,et al.  Microscopic mechanism of hydrogen passivation of acceptor shallow levels in silicon. , 1985, Physical review letters.

[8]  Daniel M. Fleetwood,et al.  1/f noise, hydrogen transport, and latent interface-trap buildup in irradiated MOS devices , 1997 .

[9]  Hydrogen in crystalline semiconductors , 1987 .

[10]  Mechanisms of ionizing-radiation-induced degradation in modern bipolar devices , 1991, Proceedings of the 1991 Bipolar Circuits and Technology Meeting.

[11]  Ronald D. Schrimpf,et al.  Dose‐rate effects on radiation‐induced bipolar junction transistor gain degradation , 1994 .

[12]  P. Kenkare,et al.  Relationship between trapped holes, positive ions, and interface states in irradiated Si‐SiO2 structures , 1989 .

[13]  R. L. Pease,et al.  Moderated degradation enhancement of lateral pnp transistors due to measurement bias , 1998 .

[14]  J. Sun,et al.  Deactivation of the boron acceptor in silicon by hydrogen , 1983 .

[15]  Pantelides,et al.  Microscopic structure of the hydrogen-boron complex in crystalline silicon. , 1989, Physical review. B, Condensed matter.

[16]  R. L. Pease,et al.  Comparison of ionizing-radiation-induced gain degradation in lateral, substrate, and vertical PNP BJTs , 1995 .

[17]  Stavola,et al.  Vibrational spectroscopy of acceptor-hydrogen complexes in silicon: Evidence for low-frequency excitations. , 1988, Physical review. B, Condensed matter.

[18]  J. R. Brews,et al.  The determination of Si-SiO/sub 2/ interface trap density in irradiated four-terminal VDMOSFETs using charge pumping , 1996 .

[19]  Stutzmann,et al.  Microscopic structure of boron-hydrogen complexes in crystalline silicon. , 1988, Physical review. B, Condensed matter.

[20]  David L. Griscom,et al.  Formation of interface traps in MOSFETs during annealing following low temperature irradiation , 1988 .

[21]  R. L. Pease,et al.  Hardness assurance implications of bimodal total dose response in a bipolar linear voltage comparator , 1999 .

[22]  Synergetic effects of radiation stress and hot-carrier stress on the current gain of npn bipolar junction transistors , 1994 .

[23]  Chih-Tang Sah,et al.  Deactivation of group III acceptors in silicon during keV electron irradiation , 1983 .

[24]  Jacques I. Pankove,et al.  Neutralization of acceptors in silicon by atomic hydrogen , 1984 .

[25]  F. Ponce,et al.  Hydrogen in crystalline semiconductors : a review of experimental results , 1991 .

[26]  R. L. Pease,et al.  Hardness assurance testing of bipolar junction transistors at elevated irradiation temperatures , 1997 .

[27]  Keith A. Jenkins,et al.  Use of electron-beam irradiation to study performance degradation of bipolar transistors after reverse-bias stress , 1991, International Electron Devices Meeting 1991 [Technical Digest].

[28]  S. Pearton,et al.  Hydrogen injection and neutralization of boron acceptors in silicon boiled in water , 1986 .

[29]  P. S. Winokur,et al.  Two‐stage process for buildup of radiation‐induced interface states , 1979 .

[30]  J. Chevallier,et al.  Hydrogen in Crystalline Semiconductors , 1988 .

[31]  Arthur H. Edwards,et al.  Post‐irradiation cracking of H2 and formation of interface states in irradiated metal‐oxide‐semiconductor field‐effect transistors , 1993 .

[32]  Johnson,et al.  Structure of the boron-hydrogen complex in crystalline silicon. , 1987, Physical review. B, Condensed matter.

[33]  A. Tavendale,et al.  Field drift of the hydrogen‐related, acceptor‐neutralizing defect in diodes from hydrogenated silicon , 1985 .

[34]  Allan H. Johnston,et al.  Enhanced damage in bipolar devices at low dose rates: effects at very low dose rates , 1996 .

[35]  N. Johnson,et al.  Absence of oxygen diffusion during hydrogen passivation of shallow‐acceptor impurities in single‐crystal silicon , 1985 .

[36]  J. Boesch,et al.  Time-dependent interface trap effects in MOS devices , 1988 .

[37]  R. L. Pease,et al.  Trends in the total-dose response of modern bipolar transistors , 1992 .

[38]  A. V. Sogoyan,et al.  The effect of emitter junction bias on the low dose-rate radiation response of bipolar devices , 1997 .

[39]  B. J. Mrstik,et al.  Si-SiO/sub 2/ interface state generation during X-ray irradiation and during post-irradiation exposure to a hydrogen ambient (MOSFET) , 1991 .

[40]  B. J. Mrstik,et al.  Model for Si–SiO2 interface state formation during irradiation and during post‐irradiation exposure to hydrogen environment , 1991 .

[41]  S. Lai,et al.  Interface trap generation in silicon dioxide when electrons are captured by trapped holes , 1983 .

[42]  Excess collector current due to an oxide-trapped-charge-induced emitter in irradiated NPN BJT's , 1995 .

[43]  peixiong zhao,et al.  Physical mechanisms contributing to enhanced bipolar gain degradation at low dose rates , 1994 .

[44]  Klein,et al.  Hydrogen permeability in thermally grown films of SiO2 on silicon substrates. , 1993, Physical review. B, Condensed matter.

[45]  F. B. McLean A Framework for Understanding Radiation-Induced Interface States in SiO2 MOS Structures , 1980, IEEE Transactions on Nuclear Science.

[46]  Ronald D. Schrimpf,et al.  Saturation of the dose-rate response of bipolar transistors below 10 rad(SiO/sub 2/)/s: implications for hardness assurance , 1994 .

[47]  Keller,et al.  Passivation of shallow acceptors by H in Si: A microscopic study by perturbed angular correlations. , 1987, Physical review letters.

[48]  Weber,et al.  Boron reactivation kinetics in hydrogenated silicon after annealing in the dark or under illumination. , 1991, Physical review. B, Condensed matter.

[49]  J. Suehle,et al.  Relaxation of Si-SiO/sub 2/ interfacial stress in bipolar screen oxides due to ionizing radiation , 1995 .

[50]  R. L. Pease,et al.  Hardness-assurance and testing issues for bipolar/BiCMOS devices , 1993 .

[51]  Chih-Tang Sah,et al.  Study of the atomic models of three donorlike defects in silicon metal‐oxide‐semiconductor structures from their gate material and process dependencies , 1984 .

[52]  Arthur R. Hart,et al.  Hardness Assurance Considerations for Long-Term Ionizing Radiation Effects on Bipolar Structures , 1978, IEEE Transactions on Nuclear Science.

[53]  Kenneth F. Galloway,et al.  Space charge limited degradation of bipolar oxides at low electric fields , 1998 .

[54]  S. Lai,et al.  Two‐carrier nature of interface‐state generation in hole trapping and radiation damage , 1981 .

[55]  R. L. Pease,et al.  A proposed hardness assurance test methodology for bipolar linear circuits and devices in a space ionizing radiation environment , 1997 .

[56]  R. L. Pease,et al.  Enhanced low-dose-rate sensitivity of a low-dropout voltage regulator , 1998 .

[57]  R. L. Pease,et al.  Hardness-assurance issues for lateral PNP bipolar junction transistors , 1995 .

[58]  R. L. Pease,et al.  Modeling ionizing radiation induced gain degradation of the lateral PNP bipolar junction transistor , 1996 .

[59]  D. C. Mayer,et al.  Charge separation technique for metal–oxide–silicon capacitors in the presence of hydrogen deactivated dopants , 2000 .

[60]  B. F. Lewis,et al.  XPS Studies of Structure-Induced Radiation Effects at the Si/SiO2 Interface , 1980, IEEE Transactions on Nuclear Science.

[61]  J. Pankove,et al.  Hydrogen localization near boron in silicon , 1985 .

[62]  H. E. Boesch,et al.  An overview of radiation-induced interface traps in MOS structures , 1989 .

[63]  Estreicher,et al.  Hydrogen passivation of shallow acceptors and donors in c-Si: Comparisons and trends. , 1989, Physical review. B, Condensed matter.

[64]  R. L. Pease,et al.  Enhanced low dose rate sensitivity (ELDRS) of linear circuits in a space environment , 1999 .

[65]  Jacques I. Pankove,et al.  Temperature dependence of boron neutralization in silicon by atomic hydrogen , 1990 .

[66]  Ronald D. Schrimpf Recent advances in understanding total-dose effects in bipolar transistors , 1995 .

[67]  Andersen,et al.  Lattice location of deuterium interacting with the boron acceptor in silicon. , 1988, Physical review letters.

[68]  Stephen Aplin Lyon,et al.  Relationship between hole trapping and interface state generation in metal‐oxide‐silicon structures , 1988 .

[69]  C. Sah,et al.  Carrier Generation and Recombination in P-N Junctions and P-N Junction Characteristics , 1957, Proceedings of the IRE.

[70]  Fowler,et al.  Hydrogen-acceptor pairs in silicon: Pairing effect on the hydrogen vibrational frequency. , 1985, Physical review. B, Condensed matter.

[71]  peixiong zhao,et al.  Radiation effects at low electric fields in thermal, SIMOX, and bipolar-base oxides , 1996 .

[72]  Dennis B. Brown,et al.  Time dependence of radiation‐induced interface trap formation in metal‐oxide‐semiconductor devices as a function of oxide thickness and applied field , 1991 .

[73]  Stutzmann Hydrogen passivation of boron acceptors in silicon: Raman studies. , 1987, Physical review. B, Condensed matter.

[74]  David L. Griscom,et al.  Hydrogen model for radiation-induced interface states in SiO2-on-Si Structures: A review of the evidence , 1992 .

[76]  P. S. Winokur,et al.  Radiation-Induced Interface-State Generation in MOS Devices , 1986, IEEE Transactions on Nuclear Science.

[77]  C. A. Goben,et al.  Comparison of the degradation effects of heavy ion, electron, and cobalt-60 irradiation in an advanced bipolar process , 1988 .

[78]  Daniel M. Fleetwood,et al.  Field dependence of interface-trap buildup in polysilicon and metal gate MOS devices , 1990 .

[79]  S. Pearton,et al.  Vibrational characteristics of acceptor‐hydrogen complexes in silicon , 1987 .

[80]  W. C. Johnson,et al.  Relationship between x‐ray‐produced holes and interface states in metal‐oxide‐semiconductor capacitors , 1983 .

[81]  R. L. Pease,et al.  Gain degradation of lateral and substrate pnp bipolar junction transistors , 1996 .

[82]  C. Sah,et al.  Hydrogenation and annealing kinetics of group‐III acceptors in oxidized silicon , 1985 .

[83]  Daniel M. Fleetwood,et al.  Using laboratory X-ray and cobalt-60 irradiations to predict CMOS device response in strategic and space environments , 1988 .

[84]  Allan H. Johnston,et al.  Total dose effects in conventional bipolar transistors and linear integrated circuits , 1994 .

[85]  Keith A. Jenkins,et al.  Electron beam damage of advanced silicon bipolar transistors and circuits , 1988, Technical Digest., International Electron Devices Meeting.

[86]  Nelson S. Saks,et al.  The time-dependence of post-irradiation interface trap build-up in deuterium-annealed oxides (n-MOSFET) , 1992 .

[87]  N. Saks,et al.  Interface trap formation via the two-stage H/sup +/ process , 1989 .

[88]  Daniel M. Fleetwood,et al.  Effects of irradiation temperature on MOS radiation response , 1997 .

[89]  R. K. Lawrence,et al.  Post-irradiation behavior of the interface state density and the trapped positive charge , 1990 .

[90]  E. Courcelle,et al.  Field-enhanced neutralization of electrically active boron in hydrogen implanted Schottky diodes , 1986 .

[91]  B. Mrstik Post-irradiation formation of Si-SiO2 interface states in a hydrogen atmosphere at room temperature , 1991 .

[92]  Daniel M. Fleetwood,et al.  Charge yield for cobalt-60 and 10-keV X-ray irradiations of MOS devices , 1991 .

[93]  John A. Zoutendyk,et al.  Lateral charge transport from heavy-ion tracks in integrated circuit chips , 1988 .

[94]  Daniel M. Fleetwood,et al.  Charge separation in bipolar transistors , 1993 .

[95]  Chang,et al.  Theory of hydrogen passivation of shallow-level dopants in crystalline silicon. , 1988, Physical review letters.

[96]  P. Winokur,et al.  Simple technique for separating the effects of interface traps and trapped‐oxide charge in metal‐oxide‐semiconductor transistors , 1986 .

[97]  M. Gehlhausen,et al.  Elevated temperature irradiation of bipolar linear microcircuits , 1996 .

[98]  F. Saigne,et al.  Modeling low-dose-rate effects in irradiated bipolar-base oxides , 1998 .

[99]  peixiong zhao,et al.  Physically based comparison of hot-carrier-induced and ionizing-radiation-induced degradation in BJTs , 1995 .

[100]  R. Pierret Field effect devices , 1983 .

[101]  Walter C. Johnson,et al.  Relationship between trapped holes and interface states in MOS capacitors , 1980 .

[102]  James M. Puhl,et al.  ACCELERATED TESTS FOR SIMULATING LOW DOSE RATE GAIN DEGRADATION OF LATERAL AND SUBSTRATE PNP BIPOLAR JUNCTION TRANSISTORS , 1996 .

[103]  S. Lyon,et al.  Amphoteric defects at the Si‐SiO2 interface , 1986 .

[104]  Stephen J. Pearton,et al.  HYDROGEN DIFFUSION IN CRYSTALLINE SEMICONDUCTORS , 1991 .

[105]  E. H. Nicollian,et al.  Mos (Metal Oxide Semiconductor) Physics and Technology , 1982 .

[106]  N. Saks,et al.  Observation of H/sup +/ motion during interface trap formation , 1990 .

[107]  J. Pankove,et al.  Neutralization of Shallow Acceptor Levels in Silicon by Atomic Hydrogen , 1983 .

[108]  S. Pearton,et al.  Configurations and Properties of Hydrogen in Crystalline Semiconductors , 1991 .

[109]  Dennis B. Brown,et al.  Time dependence of interface trap formation in MOSFETs following pulsed irradiation , 1988 .

[110]  N. M. Johnson,et al.  Electric field dependence of hydrogen neutralization of shallow‐acceptor impurities in single‐crystal silicon , 1985 .

[111]  Daniel M. Fleetwood,et al.  Effects of interface traps and border traps on MOS postirradiation annealing response , 1995 .

[112]  M. Thewalt,et al.  Photoluminescence studies of the neutralization of acceptors in silicon by atomic hydrogen , 1985 .

[113]  P. S. Winokur,et al.  The Role of Hydrogen in Radiation-Induced Defect Formation in Polysilicon Gate MOS Devices , 1987, IEEE Transactions on Nuclear Science.

[114]  Johnson Nm Mechanism for hydrogen compensation of shallow-acceptor impurities in single-crystal silicon. , 1985 .