Tape & Reel single side peel force test verification

In semiconductor manufacturing processing, IC chips need to be shipped or transferred to EOL (End of Line), SMT (Surface Mounted Technology) or customers after assembly processing and final test. Before these processes, the dry packing is necessary which is also required by JEDEC (Joint Electron Device Engineering Council) standard. Generally, Tape & Reel packing is a typical method among lots of packing methods. This packing method has more advantages than others such as easier carry, easier transfer and lower cost. However, it also has more challenges due to its carry quality and capacity. It has to meet packing quality in transfer process and also meet packing performance in EOL procedure; If the packing quality is poor, the device may drop down and be damaged during transferring, which will cause a lot of troubles between supplier and customer. So packing ability and verification is very important. This paper introduced a method to control sealing ability for Tape and Reel packing process.