천장복사패널의 모델링에 대한 연구

Ceiling radiant panel is appropriate in high-rising office buildings for many advantages. In order to meet the requirement on energy saving and comfort, modeling is critical to research the heat performance analysis. Various assumptions can create many different solutions for modeling the ceiling radiant panel. On this study, current modeling methods for ceiling radiant panel were analyzed considering heat transfer phenomenon. As a result, more detailed modeling method for ceiling radiant panel was proposed using RC network.