Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction

A novel approach for constructing multi-port dynamic compact thermal models of nonlinear heat diffusion in electronic components is presented, extending a technique previously conceived for the one-port case. The approach allows achieving high levels of accuracy even for small state-space dimensions of the model. It is also very efficient since it requires the solutions to a few linear heat diffusion problems in the frequency domain. The multi-port compact models exhibit structure similar to the one-port counterparts and can be used to accurately approximate not only the junction temperatures, but also the whole space-time temperature distribution within the electronic components.

[1]  M. Rencz,et al.  Thermal Measurement and Modeling of Multi-Die Packages , 2006, IEEE Transactions on Components and Packaging Technologies.

[2]  Paolo Maffezzoni,et al.  Compact modeling of electrical devices for electrothermal analysis , 2003 .

[3]  Paolo Maffezzoni,et al.  An Arnoldi based thermal network reduction method for electro-thermal analysis , 2003 .

[4]  M. Rencz,et al.  A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards , 2007, IEEE Transactions on Components and Packaging Technologies.

[5]  P. Maffezzoni,et al.  Analytical multipoint moment matching reduction of distributed thermal networks , 2004, IEEE Transactions on Components and Packaging Technologies.

[6]  M.-N. Sabry,et al.  Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress , 2003 .

[7]  L. Codecasa,et al.  Compact Models of Dynamic Thermal Networks with Many Heat Sources , 2007, IEEE Transactions on Components and Packaging Technologies.

[8]  Paolo Maffezzoni,et al.  Thermal networks for electro-thermal analysis of power devices , 2001 .

[9]  Alessandro Magnani,et al.  Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC) , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[10]  W. Rugh.  Nonlinear System Theory: The Volterra / Wiener Approach , 1981 .

[11]  P. Maffezzoni,et al.  Multipoint moment matching reduction from port responses of dynamic thermal networks , 2005, IEEE Transactions on Components and Packaging Technologies.

[12]  Alessandro Magnani,et al.  Dynamic Electrothermal Macromodeling: an Application to Signal Integrity Analysis in Highly Integrated Electronic Systems , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[13]  Alessandro Magnani,et al.  Compact Dynamic Modeling for Fast Simulation of Nonlinear Heat Conduction in Ultra-Thin Chip Stacking Technology , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[14]  Lorenzo Codecasa,et al.  Compact electro-thermal models of interconnects , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[15]  Alessandro Magnani,et al.  Multi-port dynamic compact thermal models of nonlinear heat conduction , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[16]  Lorenzo Codecasa,et al.  Novel approach to compact modeling for nonlinear thermal conduction problems , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[17]  W. B. Joyce,et al.  Thermal resistance of heat sinks with temperature-dependent conductivity , 1975 .

[18]  Alessandro Magnani,et al.  Parametric compact thermal models by moment matching for variable geometry , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[19]  M. Dessouky,et al.  A framework theory for Dynamic Compact Thermal Models , 2012, 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[20]  Lorenzo Codecasa.  Nonlinear dynamic compact thermal models by structure-preserving projection , 2014, Microelectron. J..

[21]  P. Maffezzoni,et al.  Compact thermal networks for modeling packages , 2004, IEEE Transactions on Components and Packaging Technologies.

[22]  Clemens J. M. Lasance,et al.  Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review , 2008 .