Hybrid routing on multichip modules

A hybrid routing approach for multichip modules (MCMs) is proposed. The routing implementation is divided into three stages: signal-net routing, I/O-pad interconnection, and power/ground layout. A special feature of the implementation is that, in the second stage, some interconnected segments are allowed to be tilted with a slope for reducing the MCM layout area. Experimental results on MCM examples indicate that the performance of the hybrid routing is very encouraging.<<ETX>>