The Impact of Surface Defects on SiC Schottky and Ohmic Contact Formation

Silicon carbide is a leading semiconductor for high power, high temperature electronics, yet SiC devices still face problems of electrical contact control and reproducibility. Recent work worldwide shows that point and extended defects in SiC as well as chemical reactions at metal-SiC interfaces can influence contact transport properties. Yet Schottky barrier and ohmic contact formation at the intimate metal-SiC junction are relatively unexplored on the microscopic level. We have used depth-resolved cathodoluminescence spectroscopy (DRCLS) and Auger electron spectroscopy (AES) to measure the optical emissions of defects near 4H-SiC surfaces and metallized interfaces on a nanometer scale. These techniques reveal that a variety of metals on clean 4H-SiC surfaces in ultrahigh vacuum (UHV) promote the formation of mid-gap defects extending only nanometers away from the junction. These states vary in their ranges of depth and depend sensitively on interface reactivity and subsequent UHV annealing