CHARACTERIZATION OF VIA HOLES DISCONTINUITIES BY

A method for de-embedding scattering parameters S of a via hole in multilayer printed circuit board is presented. By assuming that the via bole is not electromagnetically coupled with the adjacent lines, the scattering parameters are evaluated starting from the calculation of the transfer scattering matrix T obtained by a three dimensional full wave analysis of the test structure. The numerical approach used to obtain S and T parameters has been validated by comparison with results computed by other independent numerical methods and measurements. The proposed methodology allows a computational time saving and gives useful results for a CAD modeling of via hole discontinuities.

[1]  Joungho Kim,et al.  Embedded microstrip interconnection lines for gigahertz digital circuits , 2000 .

[2]  Ke Wu,et al.  Characterization of unbounded multiport microstrip passive circuits using an explicit network-based method of moments , 1997 .

[3]  L. Katehi,et al.  Modeling of coplanar stripline discontinuities , 1996 .

[4]  Ke Wu,et al.  Comparative investigation on numerical de-embedding techniques for equivalent circuit modeling of lumped and distributed microstrip circuits , 2002 .

[5]  H. Cho,et al.  A three-step method for the de-embedding of high-frequency S-parameter measurements , 1991 .

[6]  Daniël De Zutter,et al.  A new de-embedding technique for on-board structures applied to the bandwidth measurement of packages , 1993 .

[7]  R. Mavaddat.  Network Scattering Parameters , 1996, Advanced Series in Circuits and Systems.

[8]  J. P. Mondal,et al.  Propagation constant determination in microwave fixture de-embedding procedure , 1988 .

[9]  Larry Epp,et al.  A generalized scattering matrix approach for analysis of quasi-optical grids and de-embedding of dev , 1996 .

[10]  Jiming Song,et al.  A de-embedding technique for interconnects , 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

[11]  S. Sercu,et al.  Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors , 1997, Electrical Performance of Electronic Packaging.

[12]  G. Gronau,et al.  A simple broad-band device de-embedding method using an automatic network analyzer with time-domain option , 1989 .