Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys
暂无分享,去创建一个
Wislei R. Osório | Leandro C. Peixoto | Nathalie Mangelinck-Noël | Leonardo R. Garcia | Amauri Garcia | N. Mangelinck-Noël | Amauri Garcia | W. R. Osório | L. C. Peixoto | L. R. Garcia
[1] W. J. Tomlinson,et al. The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder , 1987 .
[2] W. Kurz,et al. Fundamentals of Solidification , 1990 .
[3] L. Felton,et al. Pb-free Soldering Alternatives For Fine Pitched Electronics Packaging , 1992, Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.
[4] Huifen. Chen,et al. New lead-free, Sn-Zn-In solder alloys , 1994 .
[5] R. Mccabe,et al. Athermal and thermally activated plastic flow in low melting temperature solders at small stresses , 1998 .
[6] Carlos Alexandre dos Santos,et al. Correlation between unsteady-state solidification conditions, dendrite spacings, and mechanical properties of Al-Cu alloys , 2000 .
[7] M. Abtew,et al. Lead-free Solders in Microelectronics , 2000 .
[8] K. S. Kim,et al. Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys , 2002 .
[9] Amauri Garcia,et al. Mechanical properties as a function of thermal parameters and microstructure of Zn–Al castings , 2003 .
[10] Kwang-Lung Lin,et al. Improvement in the properties of Sn-Zn Eutectic based Pb-free solder , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[11] Katsuaki Suganuma,et al. Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys , 2003 .
[12] Chi‐Man Lawrence Wu,et al. Properties of lead-free solder alloys with rare earth element additions , 2004 .
[13] S. L. Ngoh,et al. Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints , 2004 .
[14] Paul Conway,et al. Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics , 2006 .
[15] Y. C. Chan,et al. Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders , 2006, Microelectron. J..
[16] Chen Wei,et al. Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5% Ag solders , 2006 .
[17] Qi-qiang Sun,et al. Effect of liquid-liquid structure transition on solidification of Sn-Bi alloys , 2007 .
[18] C. Wei,et al. Microstructures of eutectic Sn–Ag–Zn solder solidified with different cooling rates , 2008 .
[19] M. Rapone,et al. Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders , 2008 .
[20] Amauri Garcia,et al. Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn–9%Zn solder alloy , 2009 .
[21] Zhiming Gao,et al. Effects of aging on structural evolution of the rapidly solidified Sn–Ag–Zn eutectic solder , 2009 .
[22] Chi‐Man Lawrence Wu,et al. The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering , 2010 .
[23] Shou-Yi Chang,et al. Mechanical property and fracture behavior characterizations of 96.5 Sn–3.0 Ag–0.5 Cu solder joints , 2010 .
[24] Y. C. Chan,et al. Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads , 2010 .
[25] Amauri Garcia,et al. Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array , 2010 .
[26] X. R. Zhang,et al. The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures , 2010 .
[27] Amauri Garcia,et al. Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array , 2011 .
[28] Jong-Hyun Lee,et al. Ductility Enhancement in Sn-40Bi-X Alloys by Minor Additions of Alloying Elements , 2011 .
[29] Wislei R. Osório,et al. The effect of cooling rate on the dendritic spacing and morphology of Ag3Sn intermetallic particles of a SnAg solder alloy , 2011 .
[30] Amauri Garcia,et al. The Correlation between Electrochemical Corrosion Resistance and Mechanical Strength of As-Cast Al-Cu and Al-Si Alloys , 2011 .
[32] W. Ke,et al. Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition , 2012 .
[33] M. M. Arafat,et al. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds , 2012 .
[34] Daniel Rodrigo Leiva,et al. Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology , 2013 .