Considerations of characterizing standard SMT packages for RFIC applications

Modeling of the RF characteristics of commercial SMT packages is discussed in this paper. The modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques to the package leads for the initial electrical parameters of a package. Then, a direct lead measurement was performed to model the package for wireless communication applications. Package ground inductance and the number of grounded leads are presented. Back-to-back package measurements were made to verify the package parameters.