论文信息 - A new chip-thickness model for performance assessment of silicon carbide grinding

A new chip-thickness model for performance assessment of silicon carbide grinding

The chip-thickness models, used to assess the performance of grinding processes, play a major role in predicting the surface quality. In the present paper, an attempt has been made to develop a new chip-thickness model for the performance assessment of silicon carbide grinding by incorporating the modulus of elasticities of the grinding wheel and the workpiece in the existing basic chip-thickness model to account for elastic deformation. The new model has been validated by conducting experiments, taking the surface roughness as a parameter of evaluation .

P. Venkateswara Rao | Anne Venu Gopal

[1] M. C. Shaw,et al. Grinding Wheel Elasticity , 1971 .

[2] P. Venkateswara Rao,et al. The optimisation of the grinding of silicon carbide with diamond wheels using genetic algorithms , 2003 .

[3] D. P. Saini,et al. Practical Significance of Contact Deflections in Grinding , 1982 .

[4] Stephen Malkin,et al. Grinding Technology: Theory and Applications of Machining with Abrasives , 1989 .

[5] I. Inasaki. Grinding of hard and brittle materials , 1987 .

[6] S. Jahanmir,et al. EFFECT OF GRINDING ON STRENGTH OF TETRAGONAL ZIRCONIA AND ZIRCONIA-TOUGHENED ALUMINA , 1997 .

[7] S. Malkin,et al. Upper bound analysis for specific energy in grinding of ceramics , 1999 .

[8] J. Mayer,et al. Effect of Grit Depth of Cut on Strength of Ground Ceramics , 1994 .

[9] Said Jahanmir,et al. Ceramic machining: Assessment of current practice and research needs in the United States. Special pub. (Final) , 1992 .

[10] Ichiro Inasaki,et al. Modelling and Simulation of Grinding Processes , 1992 .

[11] Xun Chen,et al. Analysis and simulation of the grinding process. Part I: Generation of the grinding wheel surface , 1996 .