A Robust, Compact SPICE Model for Piezoelectric Ultrasonic Transducer Array Elements

A new high-accuracy SPICE model for piezoelectric ultrasonic transducer array elements has been developed using advanced non-linear regression curve fitting techniques. This allows integrated design of ultrasonic array elements and CMOS circuitry, avoiding difficulties with hybrid models. Simulated and measured data show improved quality of fit across a wide frequency range when compared to a conventional model. By specifying a frequency range of interest, the non-isolated modes common in practical ultrasonic array elements can also be modelled, providing a route to the use of Monte Carlo AC simulation. This has important implications for the many future devices that will be built using CMOS circuitry integrated with ultrasonic arrays.