rf optoelectronic transmitter and receiver arrays on silicon wafer boards
暂无分享,去创建一个
M. Tabasky | Willie W. Ng | Daniel Yap | Craig Armiento | Paul O. Haugsjaa | Andrew J. Negri | Huan-Wun Yen | Hui Pin Hsu | Deborah M. Bohmeyer | J. F. Mehr | H. Hsu | W. Ng | H. Yen | A. Negri | P. Haugsjaa | D. Yap | C. Armiento | J. Mehr | D. M. Bohmeyer | Marvin J. Tabasky
[1] Yung-Cheng Lee,et al. Design of solder joints for self-aligned optoelectronic assemblies , 1995 .
[2] Kenji Kawano,et al. Laser diodes monolithically integrated with spot-size converters fabricated on 2 inch InP substrates , 1995 .
[3] Jagannath Chirravuri,et al. Four-channel hybrid receiver using a silicon substrate for packaging , 1992 .
[4] Willie W. Ng,et al. Dynamic characteristics of high speed p-substrate GaInAsP buried crescent lasers , 1989 .
[5] S. D. Perrin,et al. Passive alignment of a tapered laser with more than 50% coupling efficiency , 1995 .
[6] M. Tabasky,et al. Silicon wafer board alignment of laser arrays to single-mode optical fiber for analog optoelectronic module applications , 1996, Other Conferences.
[7] P. Buchmann,et al. A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology , 1994 .
[8] M. Tabasky,et al. Gigabit transmitter array modules on silicon waferboard , 1992 .
[9] H. Melchior,et al. OEIC Packaging with Self-aligned Fiber to Waveguide Array Coupling by Si V-groove Flip-Chip Technique , 1994 .
[10] Mitchell S. Cohen,et al. Packaging of high-density fiber/laser modules using passive alignment techniques , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.